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Failure-Free Integrated Circuit Packages

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Description:SPOT, STOP, AND ANALYZE IC DEVICE FAILURE WITH THIS UNIQUE ILLUSTRATED GUIDE Worth more than a thousand words, each illustration in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques.Failure-Free Integrated Circuit Packages helps you:* Find, identify, and correct potential failures before they occur* Improve device reliability* Learn from case studies of IC package failure modes* Quickly locate failures through visual comparisons* Apply state-of-the-art failure analysis techniques* Comprehend the physics behind the failure mechanism* Understand the limitations of reliability testing and lifetime estimation INSIDE, YOU’LL FIND A PRACTICAL AND EASY WAY TO APPROACH FAILURE ANALYSIS OF ICs IN ORGANIC PACKAGES. AREAS COVERED INCLUDE: Fundamentals of IC package technologiesReliabilityPhysics and chemistry of failures in packaged devicesStrategies for locating failuresFailure analysis techniquesFailure modes common in organic IC packagesEmerging assembly materials for IC packaging Charles Cohn is a distinguished member of the technical staff at Agere Systems, Allentown, Pennsylvania, where he is the lead resource on PCB technology, supporting the development of advanced organic PBGA substrates for wire bonded and flip chip IC interconnections. He has authored chapters in several McGraw-Hill electronic packaging handbooks and presented numerous papers on electronic packaging. He has been awarded 11 U.S. patents on IC packaging. Mr. Cohn holds B.S., M.S., and M.E. degrees in mechanical engineering from Columbia University.Charles A. Harper is president of Technology Seminars, Inc., Lutherville, Maryland, an organization dedicated to the presentation of educational seminars on electronic packaging and materials. He has authored over a dozen well-known books in the field and is among the founders and past presidents of the International Microelectronics Electronic and Packaging Society. He is also series editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of the Johns Hopkins University School of Engineering, where he also served as adjunct professor.Joze E. Antol - Member of Technical Staff in the Packaging and Interconnect Technology Dept. at Agere Systems, Allentown, PA. She has worked at AT&T Bell Labs / Lucent Technologies / Agere Systems for 20 years. Her current assignment focuses on the effects of probe and packaging on advanced IC technologies, such as 130nm copper / Low K. Previous assignments at AT&T / Lucent included die/wire bond process engineer in manufacturing and laboratory analyst responsible for ICP emission spectroscopy. She holds an AS degree in Chemical Engineering from Pennsylvania State University.Frank A. Baiocchi – Distinguished Member of Technical Staff at Agere Systems, Allentown, PA. Dr. Baiocchi has been with AT&T / Lucent Technologies / Agere Systems for 21 years and is currently an analyst in the Product Analysis Laboratory involved in failure site analysis on a wide variety of analog and digital technologies. He has had responsibility for plasma etch process development in support of a CMOS manufacturing line and developed an LDMOS wafer fabrication process for an RF power transistor product. His experience includes materials characterization for silicon and III-V based semiconductor devices, plasma process engineering and silicon process technology. He has published more than 40 technical articles on analysis of thin film materials using accelerator based techniques such as Rutherford Backscattering. Dr. Baiocchi holds a BS degree in Chemistry from DePaul University and a PhD degree in Physical Chemistry from Harvard University.Anthony J. Bucha – Senior Member of Technical Staff at Agere Systems, Allentown, PA. Mr. Bucha has been with Western Electric / AT&T Technologies / Lucent Technologies/ and Agere Systems for 24 years and is currently a Senior Analyst in the Product Analysis Lab. His responsibilities include product analysis for the reliability, qualification and yield improvement programs as well as administration of the labs safety program, and ISO 9001/2000 standards and documentation implementation. Previous work included opto-electronic device analysis, wafer yield improvement, and process characterization. He has written and co-authored several papers on product analysis and deprocessing techniques, some which were presented at various conferences including the International Symposium for Testing and Failure Analysis. Mr. Bucha was an active member of SEMATECH/International and the International Symposium for Testing and Failure Analysis Society.James T. Cargo R...We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Failure-Free Integrated Circuit Packages. To get started finding Failure-Free Integrated Circuit Packages, you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.

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ISBN: 0071434844

Description: SPOT, STOP, AND ANALYZE IC DEVICE FAILURE WITH THIS UNIQUE ILLUSTRATED GUIDE Worth more than a thousand words, each illustration in Failure- Free Integrated Circuit Packages gives you a visual reference on common failure modes of IC devices in organic packages. In addition, the wide knowledge base of the chapter authors provides you with proven, leading-edge failure analysis techniques.Failure-Free Integrated Circuit Packages helps you:* Find, identify, and correct potential failures before they occur* Improve device reliability* Learn from case studies of IC package failure modes* Quickly locate failures through visual comparisons* Apply state-of-the-art failure analysis techniques* Comprehend the physics behind the failure mechanism* Understand the limitations of reliability testing and lifetime estimation INSIDE, YOU’LL FIND A PRACTICAL AND EASY WAY TO APPROACH FAILURE ANALYSIS OF ICs IN ORGANIC PACKAGES. AREAS COVERED INCLUDE: Fundamentals of IC package technologiesReliabilityPhysics and chemistry of failures in packaged devicesStrategies for locating failuresFailure analysis techniquesFailure modes common in organic IC packagesEmerging assembly materials for IC packaging Charles Cohn is a distinguished member of the technical staff at Agere Systems, Allentown, Pennsylvania, where he is the lead resource on PCB technology, supporting the development of advanced organic PBGA substrates for wire bonded and flip chip IC interconnections. He has authored chapters in several McGraw-Hill electronic packaging handbooks and presented numerous papers on electronic packaging. He has been awarded 11 U.S. patents on IC packaging. Mr. Cohn holds B.S., M.S., and M.E. degrees in mechanical engineering from Columbia University.Charles A. Harper is president of Technology Seminars, Inc., Lutherville, Maryland, an organization dedicated to the presentation of educational seminars on electronic packaging and materials. He has authored over a dozen well-known books in the field and is among the founders and past presidents of the International Microelectronics Electronic and Packaging Society. He is also series editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of the Johns Hopkins University School of Engineering, where he also served as adjunct professor.Joze E. Antol - Member of Technical Staff in the Packaging and Interconnect Technology Dept. at Agere Systems, Allentown, PA. She has worked at AT&T Bell Labs / Lucent Technologies / Agere Systems for 20 years. Her current assignment focuses on the effects of probe and packaging on advanced IC technologies, such as 130nm copper / Low K. Previous assignments at AT&T / Lucent included die/wire bond process engineer in manufacturing and laboratory analyst responsible for ICP emission spectroscopy. She holds an AS degree in Chemical Engineering from Pennsylvania State University.Frank A. Baiocchi – Distinguished Member of Technical Staff at Agere Systems, Allentown, PA. Dr. Baiocchi has been with AT&T / Lucent Technologies / Agere Systems for 21 years and is currently an analyst in the Product Analysis Laboratory involved in failure site analysis on a wide variety of analog and digital technologies. He has had responsibility for plasma etch process development in support of a CMOS manufacturing line and developed an LDMOS wafer fabrication process for an RF power transistor product. His experience includes materials characterization for silicon and III-V based semiconductor devices, plasma process engineering and silicon process technology. He has published more than 40 technical articles on analysis of thin film materials using accelerator based techniques such as Rutherford Backscattering. Dr. Baiocchi holds a BS degree in Chemistry from DePaul University and a PhD degree in Physical Chemistry from Harvard University.Anthony J. Bucha – Senior Member of Technical Staff at Agere Systems, Allentown, PA. Mr. Bucha has been with Western Electric / AT&T Technologies / Lucent Technologies/ and Agere Systems for 24 years and is currently a Senior Analyst in the Product Analysis Lab. His responsibilities include product analysis for the reliability, qualification and yield improvement programs as well as administration of the labs safety program, and ISO 9001/2000 standards and documentation implementation. Previous work included opto-electronic device analysis, wafer yield improvement, and process characterization. He has written and co-authored several papers on product analysis and deprocessing techniques, some which were presented at various conferences including the International Symposium for Testing and Failure Analysis. Mr. Bucha was an active member of SEMATECH/International and the International Symposium for Testing and Failure Analysis Society.James T. Cargo R...We have made it easy for you to find a PDF Ebooks without any digging. And by having access to our ebooks online or by storing it on your computer, you have convenient answers with Failure-Free Integrated Circuit Packages. To get started finding Failure-Free Integrated Circuit Packages, you are right to find our website which has a comprehensive collection of manuals listed.
Our library is the biggest of these that have literally hundreds of thousands of different products represented.

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